Products

MEMS Sensor Sockets

Fully customized sockets for various MEMS devices and sensor devices

MiS offers a wide range of test sockets best suited for various MEMS and sensor devices

Gyro and Acceleration Sensor Sockets
Pressure Sensor, Atmosphere Pressure Sensor Sockets
Temperature and Humidity Sensor Sockets
MEMS Microphone Sensor Sockets

Gyro and Acceleration Sensor Sockets

Evaluation sockets for gyro sensor devices for automotive, video RVC (Retrieval-based Voice Changer), and AVG (Automated Guided Vehicles) applications.
High accuracy miniature gyro sensor’s angular velocity accuracy is sensitive to its material and structure. MiS socket offer fine-tuned package angle inserted in our socket with +/-0.1 degrees.
Please consult with us for your applications. We will offer the best-fit socket for sample evaluation to mass-production. Machined and molded sockets are available for small quantities.

Features: Open Top Type; Open top designs allow for automated pick and place operation; Unique design ensures reliable contacts to pads located on the top and the bottom of packages

Package Outline
Pads on the top and the bottom of package
Socket Outline

Open

Close
(Package and pins making contacts)

Examples

Pressure Sensor, Atmosphere Pressure Sensor Sockets

This socket series is suitable for electronic devices that require access to the package surface for characterization.
Available for various package types, the upper opening of the sockets is utilized for access during measurements.
The sockets have compact internal structure design in a space efficient body dimensions which helps users minimize area per a socket on PCB.
MiS evaluates the customer’s needs to select the most suitable test sockets from prototype to mass-production.

Features: Clam Shell Type; Also available for a package with a pressure sensing nozzle on the top surface of the package.; Low-cost structure

Package Outline
Socket Outline

Open

Close
(Package and pins making contacts)

Examples

Temperature and Humidity Sensor Sockets

Cost efficient small package sockets utilize special mold compound and components for enhanced humidity characteristics and wider temperature range.
Heat sink with fins design is also available for precise temperature control. Machining sockets are available from 1 pc.
MiS offers different manufacturing method (3D printing, machining, molding) depending upon required quantity and application.

Examples

MEMS Microphone Sensor Sockets

The MEMS microphone sensor sockets were born from MiS’s accumulated design and development knowledge of sensor sockets.
Cost efficient design accommodates top-side-down insertion method. MiS carries the most different kinds of sockets in the industries. We support from 1pc to mass-production quantity manufactured by different methodologies. (3D printing, machining, molding)

Features (Open Top Type): Open top structure best suitable for automated pick and place equipment; Cost efficient design by top-side-down insertion instead of bottom-side-down insertion