Products
Strengths of MiS Technologies
Market share over 70% for crystal devices
Most sold test sockets are for crystal devices. MiS Technologies designed and developed over 1,700 different designs to production to cover majority of device package types and pin configurations available in the market. We are especially specialized for ultra-miniature SMD package test sockets.
We are proud to be the market leader in the industry with over 70% market share.
Challenges for crystal device sockets
- Durability
- Self-heating
- High frequency
- High current
- Automation adaptability
- Ease of use
- Accuracy and repeatability
- Multiple pins
- Multiple device adaptability
- Cost
- Productive capacity etcetera,
MiS proudly offers four pillars of solutions
01 Bottom-Side-Up Insertion Structure
- Features
- Open top design allows for automated pick and place operation
- The bottom side up insertion design help reduce production cost
Package Outline
Socket Outline
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Open
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(Package and pins making contacts)
02 Side-Contact Structure
- Features
- Open top designs allow for automated pick and place operation
- Socket design with pins making contacts on sides of a package
Package Outline
Socket Outline
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Open
Close
(Package and pins making contacts)
03 Self-Center-Alignment Feature
- Features
- Open top designs allow for automated pick and place operation
- Drop-in self-center-alignment ensure reliable and accurate pin contact
Package Outline
Socket Outline
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Open
(Package insertion)
Centering
Close
(Package and pins making contacts)
04 High Current Sockets
- Features
- Butterfly design that allows for temperature dissipation
- Multi-layered contact pins are precisely designed to have larger contact area to device pads for high current applications.
Package Outline
Socket Outline
Close
Open
Close
(Package and pins making contacts)
